The Vertiv™ CoolChip CDU is designed to support liquid cooling within high density environments. Suitable for direct-to-chip and rear door cooling applications, it offers easy, cost-effective deployment in any data center. Models operate with and without access to facility water — choose between in-rack, in-row, or perimeter-based designs and liquid-to-liquid or liquid-to-air heat exchangers.
Seamlessly transition to high-efficiency liquid cooling technology with the Vertiv™ CoolChip CDU — the next generation of the Vertiv™ Liebert® XDU family. From hyperscale and colocation environments to edge applications, the CoolChip CDU offers flexible deployments with liquid-to-liquid heat exchange up to 1,350 kW or liquid-to-air heat exchange up to 70 kW.
| Model | Cooling Capacity | Airflow | Height | Width | Depth |
|---|---|---|---|---|---|
| Vertiv™ CoolChip CDU 70 | |||||
| Vertiv™ CoolChip CDU 70 | 70.0 kW at 11°C approach temperature difference | 10,100 m³/h (5,945 CFM) | 91 in | 24 in | 48 in |
| Vertiv™ CoolChip CDU 121 | |||||
| Vertiv™ CoolChip CDU 121 | 121 kW at 4°C approach temperature difference | — | 6.8 in (4RU) | 17.5 in | 34.2 in |
| Vertiv™ CoolChip CDU 600 | |||||
| Vertiv™ CoolChip CDU 600 | 600 kW at 4.0°C approach temperature difference | N/A | 78.7 in | 23.6 in | 47.2 in |
| Liebert® XDU1350 Coolant Distribution Unit | |||||
| Liebert® XDU1350 | 1,368 kW at 4°C approach temperature difference | N/A | 684 in | 35.4 in | 48.9 in |
Engineered for the demands of modern, high-density data centre environments.
Purpose-built components that keep your liquid cooling operating at peak performance.
Technical documentation, brochures, and data sheets for the Vertiv™ CoolChip CDU family.